solve_via_current_array
Computes minimum parallel via count for a PCB rail current using IPC barrel capacity, thermal rise, array derating, and optional fill+cap credit.
Instructions
IPC-2152 / IPC-2221 via barrel current capacity and stitching-array solver: computes the annular barrel cross-section from drill and plating, applies the thermal formula with internal/external k constants, 40% array current-sharing derate, and IPC-4761 Type VII fill+cap credit, returning the minimum parallel via count for a rail current.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| current_a | No | Rail current to carry in A (default: 3.0). | |
| is_filled | No | IPC-4761 Type VII fill+cap via (default: False). | |
| plating_um | No | Copper plating thickness in μm (default: 25.0). | |
| via_drill_mm | No | Finished drill diameter in mm (default: 0.30). | |
| max_delta_t_c | No | Allowable barrel temperature rise °C (default: 20.0). | |
| internal_layer | No | Transition between internal layers k=0.024 (default: False). | |
| max_array_size | No | Stitching ceiling before recommending wider traces (default: 8). |