calculate_teardrop_reinforcement
Compute tangent teardrop fillets for PCB vias, pads, and testpoints to prevent drill breakout and crack stress while meeting IPC-2221B and IPC-A-600J Class 3.
Instructions
Calculate tangent teardrop fillets for PCB vias, circular pads, and testpoints to prevent drill breakout, eliminate mechanical/thermal crack stress, and comply with IPC-2221B Section 9.1.5 and IPC-A-600J Class 3.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| vias | Yes | List of via objects ({'x_mm', 'y_mm', 'pad_dia_mm', 'drill_dia_mm', 'trace_angle_deg'}). | |
| teardrop_style | No | Fillet geometry: 'curved' (default) or 'linear'. | curved |
| default_trace_width_mm | No | Default trace width in mm (default: 0.20). |