calculate_wave_solder_orientation_audit
Audit bottom-side SMD wave-solder orientation and shadowing per IPC-7351B/SMTA to prevent tombstoning and bridging; verify chip passives, SOIC alignment, and tall-component keepouts.
Instructions
Audit bottom-side SMD component wave soldering orientation angles and hydrodynamic shadowing per IPC-7351B and SMTA guidelines: chip passives (0603/0805) perpendicular to flow to prevent tombstoning, SOIC ICs parallel to flow to prevent solder bridging, and 3xH shadow keepout zones behind tall components.
Tool call template
Replace each placeholder with a value matching the input schema. Only required parameters are included; add optional parameters as needed.
{
"id": 1,
"jsonrpc": "2.0",
"method": "tools/call",
"params": {
"arguments": {
"modules": "<modules>"
},
"name": "calculate_wave_solder_orientation_audit"
}
}Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| modules | Yes | Component modules dict (with rotation_deg, position, and package). | |
| flow_direction | No | Conveyor wave flow direction: 'X+' (default), 'X-', 'Y+', or 'Y-'. | X+ |