export_ipc2581
Generates a single-file IPC-2581B XML fabrication package (stackup, BOM, components, nets, board profile) to replace Gerber+Excellon+TXT bundles for PCB handoff.
Instructions
Export a simplified IPC-2581B single-file intelligent fabrication data package (XML) — stackup, BOM, placed components, nets with pin membership, and board profile — replacing the legacy Gerber+Excellon+TXT handoff bundle accepted by Siemens X / Altium / Zuken / EMS houses.
Tool call template
Replace each placeholder with a value matching the input schema. Only required parameters are included; add optional parameters as needed.
{
"id": 1,
"jsonrpc": "2.0",
"method": "tools/call",
"params": {
"arguments": {
"modules": "<modules>"
},
"name": "export_ipc2581"
}
}Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| modules | Yes | Component modules dict (from synthesize_circuit output). | |
| connections | No | Netlist connections list. | |
| project_name | No | Project/organization name embedded in the XML (default: HARDWARE_PROJECT). | HARDWARE_PROJECT |
| board_width_mm | No | PCB width in mm (default: 70.0). | |
| stackup_layers | No | Optional stackup layers ({name, class: 'CONDUCTOR'|'DIELECTRIC', thickness_um, material}). | |
| board_height_mm | No | PCB height in mm (default: 50.0). |