audit_smt_tombstone_risk
Audit SMT passive component tombstoning risk by checking pad thermal symmetry and flagging unbalanced wetting torque from solid plane connections.
Instructions
IPC-A-610G §8.3.2.9 / IPC-SM-782 SMT chip passive component thermal relief & tombstoning (Manhattan effect) risk auditor: checks thermal connection width symmetry between opposite pads on 0201/0402/0603/0805 passives, flagging direct solid plane connections without thermal relief spokes that create unbalanced wetting torque.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| components | No | List of passive component dicts ({ref, package, pad1_type, pad2_type, pad1_width_mm, pad2_width_mm}). | |
| default_trace_width_mm | No | Nominal signal trace width in mm (default: 0.20). |