calculate_solder_paste_volume
Assess per-aperture solder paste volume against IPC-7525A target ratios to flag starved joints and excess paste defects before stencil printing.
Instructions
Assess per-aperture deposited solder paste volume against target joint volume per IPC-7525A transfer analysis (accepted ratio window 1.0 ~ 2.5), flagging starved joints and excessive paste defects.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| apertures | Yes | Aperture list ({ref, shape: 'rect'|'circle', width_mm, length_mm}). | |
| foil_thickness_um | No | Stencil foil thickness in μm (default: 100). | |
| target_standoff_mm | No | Target solder standoff height in mm (default: 0.10). | |
| transfer_efficiency | No | Paste transfer efficiency η (default: 0.90; nano-coated laser-cut foil). |