audit_ipc6012_class_compliance
Audits PCB design compliance with IPC-6012E and IPC-A-600J Class 1/2/3, evaluating annular rings, PTH copper plating, conductor width, and solder mask dams.
Instructions
Audit PCB physical and metallurgical design parameters against IPC-6012E and IPC-A-600J Class 1/2/3 acceptance criteria: evaluates external/internal annular rings, zero-breakout constraints for Class 3, PTH copper barrel plating thickness (avg >= 25μm for Class 3), etch conductor width reduction, and solder mask dam widths.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| target_class | No | Target IPC reliability class: 'Class 1', 'Class 2' (default), or 'Class 3'. | Class 2 |
| has_hole_breakout | No | Whether drill hole breakout from annular ring is observed (strictly 0° allowed in Class 3). | |
| breakout_angle_deg | No | Observed breakout angle in degrees (default: 0.0). | |
| avg_copper_barrel_um | No | Average electroplated copper thickness in PTH barrels in μm (default: 22.0). | |
| min_copper_barrel_um | No | Minimum thin-point PTH copper plating thickness in μm (default: 19.0). | |
| min_solder_mask_dam_mm | No | Smallest solder mask dam width between adjacent exposed pads in mm (default: 0.090). | |
| external_annular_ring_mm | No | Smallest external annular ring width in mm (default: 0.125). | |
| internal_annular_ring_mm | No | Smallest internal annular ring width in mm (default: 0.100). | |
| conductor_width_reduction_pct | No | Conductor width reduction percentage from etch defects (default: 5.0). |