audit_component_msl_floor_life
Audits SMD packages for MSL and open-bag floor life per JEDEC J-STD-033D, flags expired components, and generates recommended baking schedules to prevent reflow popcorning.
Instructions
Audit SMD plastic packages (BGA, QFN, CSP, TQFP) for moisture sensitivity level (MSL 1 to 6) and open-bag shop floor life per JEDEC J-STD-033D and IPC-M-109, flagging expired components and generating recommended dehumidification baking schedules (e.g. 125°C for 24h or 40°C for 192h) to prevent 260°C reflow popcorning defects.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| modules | Yes | Component modules dict with refDes, package, and optional msl_level or exposed_hours. | |
| ambient_rh_pct | No | Workshop ambient relative humidity percentage (default: 55.0). | |
| ambient_temp_c | No | Workshop ambient temperature in °C (default: 25.0). | |
| exposed_hours_default | No | Default shop floor exposure hours since unsealing moisture barrier bag (default: 48.0). |