calculate_ipc7351_land_pattern
Compute IPC-7351B-compliant SMD land pattern geometry (pad width, length, center distance, courtyard bounds) from package name and density level A, B, or C.
Instructions
Calculate mathematically compliant surface mount land pattern geometry (pad width X, pad length Y, pad center distance C, and courtyard boundary bounds) based on IPC-7351B standards across Density Levels A (Most), B (Nominal), and C (Least).
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| density | No | IPC-7351B Density Level: 'A' (Most/M), 'B' (Nominal/N, default), or 'C' (Least/L). | B |
| package | Yes | Standard footprint name (e.g. '0805', '0603', 'SOIC-8', 'QFN-32', 'TSSOP-14') or custom. | |
| lead_type | No | Component lead style: 'chip', 'gullwing', 'no_lead' (QFN/DFN), or 'j_lead'. | |
| lead_pitch | No | Optional pin center-to-center pitch (mm) for multi-lead packages. | |
| lead_width_w | No | Optional component lead width (mm). | |
| lead_contact_t | No | Optional component lead contact length/band (mm). | |
| overall_length_l | No | Optional component overall tip-to-tip span (mm). |