calculate_copper_pour_current_drop
Calculate DC IR drop, Joule heating, and bottleneck current density in copper pours or busbars, then verify safe current density limits to prevent foil delamination under heavy loads.
Instructions
Calculate DC IR-drop, Joule heating dissipation, and localized bottleneck current density in polygon copper pours and power busbars per IPC-2152 Section 5.0 and IEC 60092-352, verifying current density <= 35.0 A/mm² to prevent copper foil delamination or blistering under heavy loads.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| current_a | Yes | Continuous DC load current in Amperes. | |
| ambient_temp_c | No | Ambient operating temperature in °C (default: 25.0). | |
| copper_weight_oz | No | Finished copper foil weight in oz (default: 1.0). | |
| effective_width_mm | No | Average conduction width of the copper pour in mm (default: 20.0). | |
| bottleneck_width_mm | No | Narrowest constriction neck width (e.g. around cutouts or anti-pads) in mm. | |
| effective_length_mm | No | Conduction path length from source to load in mm (default: 50.0). | |
| max_allowed_temp_rise_c | No | Allowable conductor temperature rise ΔT in °C (default: 30.0). | |
| max_allowed_current_density_a_per_mm2 | No | Maximum safe current density ceiling in A/mm² (default: 35.0). |