analyze_enig_plating
Audits ENIG/ENEPIG plating to IPC-4552A/4556 limits: checks gold, nickel, phosphorus, and palladium thickness windows, scores black-pad corrosion risk, and flags gold over 0.25 µm solder embrittlement.
Instructions
ENIG/ENEPIG plating thickness and black-pad (interfacial nickel corrosion) risk auditor per IPC-4552A and IPC-4556: verifies gold 0.050.20 μm, nickel 3.06.0 μm, phosphorus 710 wt%, and ENEPIG palladium 0.100.30 μm windows; scores galvanic black-pad susceptibility from phosphorus content, gold over-deposition, rework cycles, and process type, and flags gold >0.25 μm solder embrittlement.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| finish_type | No | Surface finish: 'enig' (default) or 'enepig'. | enig |
| rework_cycles | No | Number of prior soldering/rework thermal excursions (default: 0). | |
| gold_thickness_um | No | XRF immersion-gold thickness in μm (default: 0.08). | |
| phosphorus_wt_pct | No | Nickel deposit phosphorus content in wt% (default: 8.5). | |
| soldering_process | No | Assembly process: 'reflow' (default), 'wave', or 'hand'. | reflow |
| nickel_thickness_um | No | XRF electroless-nickel thickness in μm (default: 4.0). | |
| palladium_thickness_um | No | ENEPIG palladium barrier thickness in μm (optional). |