calculate_pcb_bow_and_twist
Evaluate PCB bow and twist warpage from stackup and copper imbalance to verify IPC limits and prevent SMT BGA open and tombstoning defects.
Instructions
IPC-TM-650 2.4.22 / IPC-6012E §3.4.4 PCB bow and twist (warpage & flatness) analyzer: evaluates residual bimetallic thermal curvature driven by dielectric stackup core/prepreg asymmetry and copper density gradients, enforcing strict <=0.75% limit for SMT assemblies to prevent BGA Head-in-Pillow (HiP) open defects and tombstoning.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| layer_count | No | Total layer count (default: 4). | |
| board_width_mm | No | Board shortest edge in mm (default: 80.0). | |
| board_length_mm | No | Board longest edge in mm (default: 100.0). | |
| board_thickness_mm | No | Total PCB thickness in mm (default: 1.60). | |
| has_smt_components | No | Whether assembly contains SMT parts <=0.75% (default: True). | |
| measured_bow_height_mm | No | Optional measured dial-gauge bow deflection in mm. | |
| dielectric_asymmetry_pct | No | Dielectric core/prepreg thickness asymmetry % (default: 0.0). | |
| measured_twist_height_mm | No | Optional measured corner lift in mm. | |
| copper_balance_ratio_top_bottom | No | Top-to-bottom copper volume ratio (default: 1.0). |