calculate_copper_thieving_balance
Balance copper density between layers to assess reflow warpage risk and generate dummy thieving patterns per IPC-2221B.
Instructions
Calculate layer copper density balance between top and bottom layers, assess reflow thermal bow/twist warpage risk (IPC-TM-650 2.4.22 <= 0.75%), and generate non-functional dummy copper thieving dot/grid patterns per IPC-2221B Section 10.1.1.
Tool call template
Replace each placeholder with a value matching the input schema. Only required parameters are included; add optional parameters as needed.
{
"id": 1,
"jsonrpc": "2.0",
"method": "tools/call",
"params": {
"arguments": {
"board_width_mm": "<board_width_mm>",
"board_height_mm": "<board_height_mm>"
},
"name": "calculate_copper_thieving_balance"
}
}Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| board_width_mm | Yes | PCB width in mm (default: 70.0). | |
| board_height_mm | Yes | PCB height in mm (default: 50.0). | |
| pattern_pitch_mm | No | Thieving dot pitch in mm (default: 2.54). | |
| keepout_margin_mm | No | Keepout margin from board edge in mm (default: 2.0). | |
| bot_copper_area_mm2 | No | Optional bottom copper area in mm². | |
| top_copper_area_mm2 | No | Optional top copper area in mm². |