estimate_solder_joint_thermal_fatigue
Estimate solder-joint thermal fatigue life for critical SMT attachments using CTE-mismatch shear strain and cycles to 63.2% failure versus service requirements.
Instructions
IPC-9701A / IPC-D-279 Engelmaier thermal cycling fatigue life estimator for critical SMT attachments: computes CTE-mismatch shear strain range over the component DNP, applies the creep-aware cycle exponent (hot dwell and mean joint temperature), and reports cycles-to-63.2%-failure against the service requirement across TC1-TC4 automotive/aerospace profiles.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| dnp_mm | No | Distance from board neutral point to farthest joint in mm (default: 15.0). | |
| component | No | Ref/designation of the worst-case component (default: U1_BGA256). | U1_BGA256 |
| condition | No | IPC-9701 profile: 'TC1' 0-100, 'TC2' -25-125, 'TC3' -40-125 (default), 'TC4' -55-125 °C. | TC3 |
| temp_max_c | No | Explicit cycle maximum °C (overrides condition). | |
| temp_min_c | No | Explicit cycle minimum °C (overrides condition). | |
| pcb_cte_ppm | No | PCB in-plane CTE in ppm/K (default: 15.0 FR-4). | |
| hot_dwell_min | No | Hot dwell time per cycle in minutes (default: 10.0). | |
| joint_height_mm | No | Solder joint standoff height in mm; BGA ~0.10-0.45, QFN ~0.05 (default: 0.10). | |
| package_cte_ppm | No | Package substrate/leadframe CTE in ppm/K (default: 14.0 BT BGA). | |
| required_cycles | No | Service cycles the attachment must survive (default: 3000). | |
| compliance_factor_f | No | Joint compliance factor (0.5 typical, 1.0 stiff; default: 0.5). |