calculate_qfn_thermal_pad_stencil
Converts QFN/BTC thermal-slug paste openings into a window-pane stencil grid with 50–70% coverage and 0.15–0.25 mm outgassing webs to prevent solder voiding, die floating, and bridging.
Instructions
IPC-7093A / IPC-7525A QFN and BTC thermal slug window-pane stencil aperture solver: converts solid 100% paste openings into an optimized matrix grid (50%70% paste coverage, default 60%) separated by 0.150.25mm bare copper web outgassing channels, preventing solder voiding (>35%), die floating, and perimeter bridging.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| pad_width_mm | No | Thermal slug width in mm (default: 4.5). | |
| web_width_mm | No | Outgassing web channel width in mm (default: 0.20). | |
| pad_height_mm | No | Thermal slug height in mm (default: 4.5). | |
| target_coverage_pct | No | Target paste coverage percentage 50~70% (default: 60.0). | |
| is_automotive_class3 | No | Whether strict Class 3 / automotive voiding limit <=15% applies (default: False). | |
| has_unfilled_thermal_vias | No | Whether open unfilled vias exist in the pad (default: False). |