pcb_place_vias
Place multiple PCB vias in one IPC round-trip to avoid repeated single-via calls while preserving precise coordinates and sizes.
Instructions
Place many vias on the active PCB in ONE IPC round-trip.
PREFER THIS over pcb_place_via whenever there is more than one
via: the batch is one PreProcess/PostProcess and one broadcast.
Coordinates and sizes keep their decimals, so a via laid by a
router on a sub-mil grid lands where the router put it.
Args: vias: List of via dicts. Each dict supports: x, y (required, mils), size (default 50), hole_size (default 28), low_layer (default "TopLayer"), high_layer (default "BottomLayer"), net (optional, empty = no net)
Returns: Dictionary with "placed" and "failed" counts and "unknown_layers" naming any layer pair that did not resolve.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| vias | Yes |
Output Schema
| Name | Required | Description | Default |
|---|---|---|---|
No arguments | |||