pcb_place_thieving_pads
Fills bare copper areas with a grid of isolated thieving pads, skipping occupied regions, to even out plating current on sparse boards.
Instructions
Fill bare copper area with a grid of isolated thieving pads.
Drops a regular grid of small round pads on layer, inside the board
outline minus margin_mils. A grid point is skipped whenever any
existing primitive (track, arc, via, pad, fill, region, polygon, or
component body) sits within half-pad + clearance of it, so pads land
only in genuinely empty regions. Pads carry no net. Evens out plating
current on sparse boards. Capped at 5000 pads per run.
Args: layer: Copper layer to populate (default TopLayer). pad_size_mils: Pad diameter (default 20). pitch_mils: Grid spacing (default 50). clearance_mils: Keep-out from existing copper (default 15). margin_mils: Inset from board edge (default 100).
Returns: {"placed", "scanned", "layer"}.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| layer | No | TopLayer | |
| pitch_mils | No | ||
| margin_mils | No | ||
| pad_size_mils | No | ||
| clearance_mils | No |
Output Schema
| Name | Required | Description | Default |
|---|---|---|---|
No arguments | |||