pcb_place_fill
Place a rectangular copper fill on the active PCB for thermal pads, ground planes, or localized copper pours, assigning coordinates, layer, and optional net.
Instructions
Place a rectangular copper fill on the active PCB.
Creates a solid copper rectangle. Useful for thermal pads, ground planes, and copper pours in specific areas.
Args: x1: First corner X in mils y1: First corner Y in mils x2: Second corner X in mils y2: Second corner Y in mils layer: PCB layer name (default "TopLayer") net_name: Net name to assign (optional, empty = no net)
Returns: Dictionary with placed fill coordinates and layer
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| x1 | Yes | ||
| x2 | Yes | ||
| y1 | Yes | ||
| y2 | Yes | ||
| layer | No | TopLayer | |
| net_name | No |
Output Schema
| Name | Required | Description | Default |
|---|---|---|---|
No arguments | |||