pcb_export_stackup_csv
Export a PCB layer stackup to a fab-ready CSV report with one row per physical layer, interleaved copper and dielectric, thickness in mil and mm, and dielectric constant values.
Instructions
Write the layer stackup to a conventional fab CSV report.
Fetches the structured stackup (pcb_get_layer_stackup) and writes
it as the board-house stackup table: one row per physical layer,
copper and dielectric interleaved top-to-bottom, thickness in mil and
mm, dielectric constant where it applies. Columns: index, layer, type,
material, thickness_mil, thickness_mm, dielectric_constant.
Args:
output_path: Destination .csv file. Defaults to
workspace/<board>_stackup.csv.
Returns: {"output_path", "rows", "layer_count", "total_thickness_mils"} or an error dict if the board / stackup could not be read.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| output_path | No |
Output Schema
| Name | Required | Description | Default |
|---|---|---|---|
No arguments | |||