pcb_place_via_array
Places a regular grid of vias across a rectangular area to stitch ground copper pours between PCB layers. Specify corners, pitch, net, pad size, drill size, and layer span.
Instructions
Stitch vias in a regular grid across a rectangle.
Typical use: GND stitching between top and bottom layer copper pours. Places vias at every (pitch × pitch) grid intersection inside the rectangle.
Args: x1: First corner X in mils y1: First corner Y in mils x2: Opposite corner X in mils y2: Opposite corner Y in mils pitch: Grid spacing in mils (default 50) net: Net to assign (typically "GND"; empty = no net) size: Via pad diameter in mils (default 30) hole_size: Drill hole diameter in mils (default 12) low_layer: Start layer (default "TopLayer") high_layer: End layer (default "BottomLayer")
Returns: Dictionary with count of vias placed and rectangle/pitch echo
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| x1 | Yes | ||
| x2 | Yes | ||
| y1 | Yes | ||
| y2 | Yes | ||
| net | No | ||
| size | No | ||
| pitch | No | ||
| hole_size | No | ||
| low_layer | No | TopLayer | |
| high_layer | No | BottomLayer |
Output Schema
| Name | Required | Description | Default |
|---|---|---|---|
No arguments | |||