pcb_analyze_thermal_via
Analyze thermal via arrays for PCB heat dissipation. Input power, via dimensions, and board thickness to assess thermal performance and optimize via design.
Instructions
Analyze thermal via array for heat dissipation.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| via_count | Yes | ||
| power_watts | Yes | ||
| via_diameter_mm | Yes | ||
| board_thickness_mm | No | ||
| copper_fill_percent | No |