pcb_analyze_solder_paste
Analyze solder paste stencil design by specifying pad width, length, pitch, and stencil thickness to detect potential printing defects and improve solder paste application.
Instructions
Analyze solder paste stencil design.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| pitch_mm | Yes | ||
| pad_width_mm | Yes | ||
| pad_length_mm | Yes | ||
| stencil_thickness_mm | No |