quality_xray_analyze
Analyze X-ray images of BGA/QFN solder joints to detect voids above 25%, bridges, and head-in-pillow defects per IPC-7095/A-610 standards.
Instructions
Station 2: X-ray solder joint analysis for BGA/QFN packages.
Uploads X-ray images of solder joints. Server analyzes void percentage, checks for solder bridges, head-in-pillow defects, and other anomalies per IPC-7095/IPC-A-610 standards.
IMPORTANT: Review the defect report and void percentages before accepting the board. Joints exceeding 25% void require rework.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| xray_images | Yes | List of paths to X-ray images (JPEG/PNG) |
Output Schema
| Name | Required | Description | Default |
|---|---|---|---|
No arguments | |||