Copper pour / zones
pcb_pourCreates copper pour zones for a chosen net and layers, fills them, and reruns DRC; unreachable pads are connected or reported, with optional stitching vias.
Instructions
Copper pour: a zone for one net (default GND) over the whole outline on the chosen layers (default F.Cu + B.Cu), then fill every zone and re-run DRC. Pads the fill cannot reach get a solid connection or a via; what still cannot join is reported with its position. stitch=true adds stitching vias. A pour on an inner layer is a plane. Re-running replaces the net's zone; remove=true deletes it; fill_only=true just refills after moving or routing. Examples: pcb_pour() · pcb_pour(net="GND", stitch=true) · pcb_pour(net="+3V3", layers=["In2.Cu"]) · pcb_pour(fill_only=true)
Tool call template
This tool declares no required parameters. Add optional parameters from the input schema as needed.
{
"id": 1,
"jsonrpc": "2.0",
"method": "tools/call",
"params": {
"arguments": {},
"name": "pcb_pour"
}
}Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| net | No | Net to pour (default GND) | |
| layers | No | Copper layers (default [F.Cu, B.Cu]) | |
| remove | No | Remove this net's zones | |
| render | No | attach a PNG (default false) | |
| stitch | No | Add a grid of stitching vias (only where both layers are filled) | |
| project | No | project path (default: active) | |
| priority | No | ||
| clearance | No | Zone clearance mm (default 0.3) | |
| fill_only | No | Only refill existing zones | |
| min_width | No | Minimum fill width mm (default 0.25) | |
| while_open | No | refuse (default) | revert | |
| thermal_gap | No | Thermal relief gap mm (default 0.5) | |
| stitch_pitch | No | Stitching via pitch mm (default 5) | |
| thermal_spoke | No | Thermal spoke width mm (default 0.5) | |
| pad_connection | No | tht_thermal (default: thermal reliefs on through-hole pads, solid SMD pads — reflow friendly, no starved thermals), thermal, solid, none |