openems_create_via
Design a via transition between PCB layers, modeling barrel, pads, and traces to estimate parasitic inductance and capacitance. Enables 2-port analysis for reflection and transmission.
Instructions
Design a via transition between two PCB layers. Models via barrel, pads, and feed traces. Estimates parasitic inductance and capacitance. 2-port geometry for reflection/transmission analysis.
Tool call template
Replace each placeholder with a value matching the input schema. Only required parameters are included; add optional parameters as needed.
{
"id": 1,
"jsonrpc": "2.0",
"method": "tools/call",
"params": {
"arguments": {
"frequency_ghz": "<frequency_ghz>",
"drill_mm": "<drill_mm>",
"pad_mm": "<pad_mm>",
"dielectric_height_mm": "<dielectric_height_mm>"
},
"name": "openems_create_via"
}
}Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| name | No | Design name | |
| pad_mm | Yes | Via pad diameter in mm | |
| drill_mm | Yes | Via drill diameter in mm | |
| substrate_er | No | Substrate dielectric constant (default 4.2) | |
| frequency_ghz | Yes | Analysis frequency in GHz | |
| dielectric_height_mm | Yes | Dielectric thickness between layers in mm |