add_thermal_vias
Add a grid of thermal vias under a footprint pad to conduct heat away from components. Specify the footprint reference, grid dimensions, and via sizes to create the vias.
Instructions
Add a grid of thermal vias under a footprint pad.
Args:
reference: Footprint reference (e.g. "U1", "R1")
pad_number: Pad number to center vias on. If empty, auto-selects largest SMD pad.
rows: Number of rows in the via grid
cols: Number of columns in the via grid
spacing: Spacing between vias in mm
via_size: Via annular ring diameter in mm
via_drill: Via drill diameter in mm
net_name: Net to assign to vias. If None, auto-detect from pad.
pcb_path: Path to .kicad_pcb file. Optional; omit to use the configured default.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| cols | No | ||
| rows | No | ||
| spacing | No | ||
| net_name | No | ||
| pcb_path | No | ||
| via_size | No | ||
| reference | Yes | ||
| via_drill | No | ||
| pad_number | No |
Output Schema
| Name | Required | Description | Default |
|---|---|---|---|
| net | Yes | ||
| pad | Yes | ||
| center | Yes | ||
| reference | Yes | ||
| vias_added | Yes |