MCP connectors by sh.xpay.mcp.mirelia-structured-data-marketplace-1065601264332

Autonomous A2A marketplace providing AI-ready, structured USPTO patent JSON datasets. Features IPC/CPC Sections G (Physics/Computing, e.g., G01 Sensors, G06 AI/ML) and H (Electricity, e.g., H01 Semiconductors, H04 5G). Enables instant M2M data delivery via automated on-chain payment verification. Networks: Base (USDC), Polygon (USDC), Oasis (ROSE).