get_packaging_costs
Returns two sub-arrays: packaging (per-tech cost benchmark + capability matrix for CoWoS-S/L, EMIB, SoIC, InFO-PoP, FC-BGA, FC-CSP, etc.) and hbmSpecs (HBM2 through HBM4 cost per stack + bandwidth/capacity). Optional type filter narrows packaging array to one technology.
USE THIS for: packaging cost lookup, comparing CoWoS variants, getting HBM stack pricing for cost modeling.
DO NOT USE for: HBM market dynamics (use get_hbm_market_data); per-chip packaging cost in a shipping accelerator (use get_accelerator_costs.costBreakdown.packagingCostUsd).
Returns INVALID_PARAMS for unknown type. Refreshes monthly.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| type | No |