trace width
trace_widthCalculates the minimum PCB trace width for a given current using the IPC-2221 standard formula. The IPC-2221 empirical equation relates current capacity to cross-sectional area and temperature rise: I = k * dT^0.44 * A^0.725, where k=0.048 for external layers and k=0.024 for internal layers. Supports configurable copper weight (oz/ft^2) and temperature rise. Also computes approximate DC resistance per centimeter. Essential for power delivery, high-current motor drivers, and ensuring PCB reliability. Chain from voltage_divider or impedance_match to verify trace sizing for computed currents.
Input Schema
| Name | Required | Description | Default |
|---|---|---|---|
| layer | No | PCB layer type. External layers dissipate heat better (k=0.048); internal layers use k=0.024. | external |
| copper_oz | No | Copper weight in ounces per square foot. 1 oz/ft^2 = 1.37 mil (34.8 um) thickness. Common values: 0.5, 1, 2. | |
| temp_rise_c | No | Allowable temperature rise above ambient in degrees Celsius. IPC-2221 standard uses 10, 20, or 30 C. | |
| current_amps | Yes | Required current capacity in amperes (A). |
Output Schema
| Name | Required | Description | Default |
|---|---|---|---|
| width_mm | Yes | Required trace width in millimeters. | |
| area_mil2 | Yes | Required cross-sectional area in square mils. | |
| width_mil | Yes | Required trace width in mils (thousandths of an inch). | |
| resistance_per_cm_mohm | Yes | Approximate DC resistance per centimeter of trace in milliohms, using copper resistivity. |